发明名称 ATTACHMENT STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To relax thermal stress exerted between a potting material for attaching an article to be fixed to a body and the body. SOLUTION: The potting material 120 is formed into a two-layer structure, and a first layer 121 contacting a silicon substrate 102 is formed of a material (soft material) having large elasticity as compared with a material of a second layer 122 stacked on the first layer 121 on the side opposite to the silicon substrate 102. That is to say, the article to be fixed 110 is attached and fixed to a glass substrate 101 mainly by the second layer 122 formed of a relatively hard material, and the silicon substrate 102 is protected mainly by the first layer 121 formed of a relatively soft material, whereby thermal stress exerted between the first layer 121 and the silicon substrate 102 (or the silicon substrate 102 and the glass substrate 101) can be relaxed by elasticity of the first layer 121. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007134140(A) 申请公布日期 2007.05.31
申请号 JP20050325402 申请日期 2005.11.09
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ENOMOTO HIDEKI;KITA HIROYUKI;EJIRI TETSUO;KISHIMOTO SHINICHI
分类号 H01H45/04;H01H51/24 主分类号 H01H45/04
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