发明名称 |
Head assembly for chip mounter |
摘要 |
A head assembly for a chip mounter is provided. The head assembly includes: a housing having a plurality of spindle receiving holes; nozzle spindles that are fitted with nozzles picking up and mounting electronic components and vertically movably inserted into the spindle receiving holes; a selection member selecting at least one of the nozzle spindles and vertically moving the selected nozzle spindle; a horizontal driver horizontally moving the selection member and changing a nozzle spindle to be selected; and an elevating driver vertically moving the selection member.
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申请公布号 |
US2007119143(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20060474632 |
申请日期 |
2006.06.26 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
RICKETSON TOMMY H. |
分类号 |
D01H9/00 |
主分类号 |
D01H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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