| 摘要 |
An electronic device cooling apparatus is disclosed that includes a cooling unit that is thermally connected to an electronic device and is configured to induce heat generated from the electronic device to be conducted to a cooling medium that is channeled into the cooling unit; and a heat dissipating unit including a cooling chamber configured to cool the cooling medium that is heated by the heat conducted from the electronic device, wherein the cooling unit and the heat dissipating unit are integrated.
|
