发明名称 |
DOUBLE INTERFACE COMMUNICATION ELECTRONIC MODULE, IN PARTICULAR FOR A CHIP CARD |
摘要 |
The invention relates to a double interface communication electronic module (11), in particular for a chip card, comprising a substrate (27) provided with an electric contact terminal (17) which makes it possible to operationally contacting the reading device contacts, is provided with an antenna which has at least one spire (13) and whose terminals are connected to the terminals of an electronic chip positioned on the module (11) face. Said module is characterised in that the antenna spires (13) are arranged substantially outside the area covered with electric contacts (17) in such a way that said electric contacts of the terminal are unable to form an electromagnetic armour to signals receivable by the antenna. Said invention is particularly suitable for producing double interface communication contact and contactless chip cards. |
申请公布号 |
WO2007026077(B1) |
申请公布日期 |
2007.05.31 |
申请号 |
WO2006FR02012 |
申请日期 |
2006.08.28 |
申请人 |
SMART PACKAGING SOLUTIONS (SPS);ARTIGUE, OLIVIER;BOCCIA, HENRI;BRUNET, OLIVIER |
发明人 |
ARTIGUE, OLIVIER;BOCCIA, HENRI;BRUNET, OLIVIER |
分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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