发明名称 |
Poliermaschine mit Dickemessvorrichtung |
摘要 |
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate. <IMAGE> |
申请公布号 |
DE60127884(D1) |
申请公布日期 |
2007.05.31 |
申请号 |
DE2001627884 |
申请日期 |
2001.01.17 |
申请人 |
EBARA CORP. |
发明人 |
KIMURA, NORIO;ISOBE, HIDEJI;SHIMIZU, KAZUO;OSAWA, HIROYUKI |
分类号 |
B24B37/04;H01L21/304;B24B7/22;B24B37/013;B24B49/04;B24B49/10;H01L21/306 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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