LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREFORE

摘要

A light emitting diode package and its fabricating method are provided to simplify the construction of the package and thus reduce a manufacturing cost by using a lead frame as a power supply terminal and heat sink. A first lead frame(100) is connected to a circuit formed on a substrate, in which one side of the first lead frame is fixed to one surface of an insulation layer(400). A second lead frame(200) is connected to the circuit, with one surface being fixed to the other surface of the insulation layer. A light emitting diode chip(300) is mounted on an upper surface of the first lead frame, and is electrically connected to the first and second lead frames. The light emitting diode chip is covered by a lens part(500). A bottom surface of the first lead frame is wider than that of the second lead frame.