LASER PROCESSING METHOD

摘要

A laser processing method in which a workpiece is prevented from being cut along a scheduled cut line with a reforming region as a cutting start point when a suction table and a holding member are separated. An expand tape (23) stretched across a frame (51) while holding the workpiece (1) is suction-secured onto the suction table (52) through a porous sheet (53). Since Young's modulus of the sheet (53) is smaller than that of the table (52), biting of the tape (23) into micro pores of the sheet (53) is suppressed. Consequently, a large bending stress does not act on the workpiece (1) even if the table (52) and the tape (23) are separated by releasing suction-securing after the reforming region (7) is formed. Consequently, the workpiece (1) can be prevented from being cut along a scheduled cut line with the reforming region (7) as a cutting start point when the table (52) and the tape (23) are separated.