发明名称 |
SEMICONDUCTOR WAFER INCLUDING SEMICONDUCTOR CHIPS DIVIDED BY SCRIBE LINE AND PROCESS-MONITOR ELECTRODE PADS FORMED ON SCRIBE LINE |
摘要 |
<p>The present invention discloses a semiconductor wafer having a scribe line dividing the semiconductor wafer into a matrix of plural semiconductor chips. The semiconductor wafer includes a polysilicon layer, a poly-metal interlayer insulation film formed on the polysilicon layer, and a first metal wiring layer formed on the poly-metal interlayer insulation film. The semiconductor wafer includes a process-monitor electrode pad formed on a dicing area of the scribe line. The process-monitor electrode pad has a width greater than the width of the dicing area. The process-monitor electrode pad includes a contact hole formed in the poly-metal insulation film for connecting the first metal wiring layer to the polysilicon layer.</p> |
申请公布号 |
WO2007061124(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
WO2006JP323872 |
申请日期 |
2006.11.22 |
申请人 |
RICOH COMPANY, LTD.;YOSHIDA, MASAAKI;KOUNO, SATOSHI |
发明人 |
YOSHIDA, MASAAKI;KOUNO, SATOSHI |
分类号 |
H01L21/66;B22D17/20;H01L21/3205;H01L21/822;H01L23/52;H01L27/04 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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