Removal of unwanted alloy from a manufactured article

摘要

A method of removing unwanted parts such as connections or coatings from a manufactured article, the parts being formed from a first alloy comprising atleast two component metals and having a melting point lower than that of each metal, comprises forming a molten mass of a second alloy which includes the metals together with further metals by heating the second alloy to a temperature greater than its melting point but below that of the first alloy, and contacting at least the unwanted parts with, or immersing them in, the molten mass whereby the unwanted parts are dissolved in the second alloy. As described with reference to Fig. 1 a vessel 11 heated by a heater 15 contains a bath 13 of an alloy of 50% Bi, 25% Pb, 12.5% Sn and 12.5% Cd into which is dipped a printed circuit card 17 to dissolve the solder from the card so that components 19 of the card can be salvaged. These components 19 may include resistors, capacitors, metallic connectors, diodes and transistors, and on the rear face of the card, Fig. 2 (not shown), are gold-plated terminals connected to land areas by solder-covered copper lines. The solder may be 60% Sn and 40% Pb having a M.P. of 361-368 DEG F. and the bath 13 which has a M.P. of about 155 DEG F. is heated to about 200 DEG F. The bath 13 may alternatively comprise the following compositions: 50% Bi, 26.7% Pb, 13.3% Sn and 10% Cd having a M.P. of 158 DEG F., this being a eutectic composition, or 50.5% Bi, 27.8% Pb, 12.5% Sn and 9.3% Cd having a melting temperature range of 158-163 DEG F., or 50% Bi, 34.5% Pb, 9.3% Sn and 6.2% Cd having a M.T.R. of 158-174 DEG F., or 50.72% Bi, 30.91% Pb, 14.97% Sn and 3.4% Cd having a M.T.R. of 158-183 DEG F. The last two compositions are preferably heated to about 200 DEG F. but the other compositions may be heated only to about 180-200 DEG F. As shown in Fig. 4, the method may be used to remove excess solder from a printed circuit card 17 which is skimmed above the surface of the bath 13 at a height corresponding to the amount of solder which is to remain on the card. The card may be placed on a belt or worm and moved across the bath following dip or wave soldering in an automated line. To mitigate the effects of expansion of the bath when this solidifies it is preferred that the alloy has between 48% and 55% Bi and not more than 33% Pb. The dissolved Sn, Pb solder may have 5-95% Sn.