| 摘要 |
968,095. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. Feb. 9, 1961 [Feb. 9, 1960], No. 4948/61. Heading H1K. In a cooling member (Figs. 2, 3, 4) for a semi-conductor device, particularly one comprising Ge or Si, a stem portion 2 supporting a plurality of cooling vanes 3 is coextensive with the vanes 3 in the longitudinal direction of the latter. A threaded aperture 5 in one end face 4 of the cooling member receives the bolt of a semi-conductor device. For securing the cooling member to a further support (not shown) two pins 7 and a threaded aperture 8 are provided at the opposite end face 6. The vane 3 adjacent end face 4 has two recesses 10, and a projecting portion 23 of the cooling member at the same end has a threaded aperture 9; these are to facilitate the provision of terminals for the semi-conductor device. Fig. 6 shows a sealed semiconductor device 19 screwed into the cooling member and having one terminal formed by projecting member 23, a screw 16, and a cupshaped washer 12a. The second terminal is formed by a similar screw 15 and washer 13a co-operating with an insulating member 22 secured to the vane comprising recesses 10 by two hollow rivets 24 in said recesses, a lead 20 emerging from the housing of device 19 through an insulating bushing 21 being connected to the second terminal by a flexible conductor 14. In a modification. Fig. 10, the cooling member is provided with an insulating layer over its entire surface or at least on that face adjacent the semi-conductor device 19; if the cooling member is of aluminium the layer may be of aluminium oxide, or a thin protective foil or brushed-on coating may be interposed between the cooling member and device 19. The housing of the device is electrically connected to a terminal screw 27, which co-operates with a nut in a recess in the cooling member by a bridge member 25. Fig. 9 shows three cooling members 1a . . . 1c, bearing devices 19a . . . 19c, connected by intermediate members 17, 18, into recesses in which the vanes fit; the whole assembly may befixed to a further support. The cooling member may be secured in heat-conducting contact with a further cooling member, either by using an intermediate member or by fitting pins 7 into corresponding apertures in the further cooling member. Copper may be used for the cooling member, and the vanes, which may be of the same or a different metal compared with the stem portion, may be integral with the stem, e.g. cast with it, or screwed to the stem or fitted into recesses in the stem and soldered, welded &c. The stem may be tapered in the direction away from the semi-conductor device, and the vanes may extend parallel to the longitudinal axis of the cooling member. A plurality of semiconductor devices may be connected to one cooling member. |
