| 摘要 |
In a silicon diode (see Division H1) a Si disc is mounted on a carrier disc of Mo or Fe or an Fe-Ni alloy by a solder which is an alloy consisting by weight of 65-75% Ag, 20-30% Cu, 1-10% Sn and incidental impurities. A preferred solder is 70% Ag, 25% Cu, 5% Sn; variations of /sB2% from these proportions are acceptable. |
