| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal wiring pattern having high definition wiring and wiring between multilayers and exhibiting excellent adhesion to an insulating film in which a conductive layer with small irregularities on the interface to the insulating film is formed easily on the surface of an arbitrary solid, and also to provide a method for forming a laminate for printed wiring board useful as an interposer between multilayer wiring having a high definition metal wiring pattern. SOLUTION: The laminate for manufacturing a printed wiring board comprises: a photosensitive resin constitutive material layer; an insulating resin composition layer which forms a reactant active species by applying energy; and a reactive polymer precursor layer containing a compound which forms a polymer compound through reaction with the insulating resin composition layer. COPYRIGHT: (C)2007,JPO&INPIT |
