发明名称 |
METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTROLLING THE REFLOW AMBIENT |
摘要 |
By controlling the cooling rate during the oxidation process for forming an oxide layer on solder balls and by selecting an elevated temperature as an initial temperature of the oxidation process, a reliable yet easily removable oxide layer may be obtained. Consequently, yield losses during the flip chip assembly process may be significantly reduced.
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申请公布号 |
US2007123020(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20060531437 |
申请日期 |
2006.09.13 |
申请人 |
JUNGNICKEL GOTTHARD;PLATZ ALEXANDER;KUECHENMEISTER FRANK |
发明人 |
JUNGNICKEL GOTTHARD;PLATZ ALEXANDER;KUECHENMEISTER FRANK |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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