发明名称 |
METHOD OF ENCLOSING A MICRO-ELECTROMECHANICAL ELEMENT |
摘要 |
<p>A method, in a complementary metal oxide semiconductor fabrication process, of creating a layered housing containing a micro-electromechanical system device, the method comprising the steps of providing a cavity in at least one layer of the housing, the cavity being accessible through via holes in a layer of insulating material deposited thereon, and the layer of insulating material being covered by a thin film layer of conductive material. The method further comprises the step of hydrophobically treating at least a portion of the inner surface of the cavity. Finally the method comprises the steps of submerging the wafer in an electroplating solution and electroplating a conductive layer onto the thin film layer of conductive material such that the cavity remains free of electroplating solution.</p> |
申请公布号 |
WO2007060414(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
WO2006GB04350 |
申请日期 |
2006.11.22 |
申请人 |
CAVENDISH KINETICS LIMITED;VAN KAMPEN, ROBERT;SMITH, CHARLES |
发明人 |
VAN KAMPEN, ROBERT;SMITH, CHARLES |
分类号 |
B81C99/00;H01L23/525 |
主分类号 |
B81C99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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