POLISHING FLUID FOR POLISHING ALUMINUM FILMS AND METHOD FOR POLISHING ALUMINUM FILMS WITH THE SAME

摘要

The invention provides a polishing fluid for aluminum films used in LSI or the like which can polish the surfaces of the films smooth at high speed and a method of polishing aluminum films with the fluid. A polishing fluid for polishing aluminum films which comprises a polycarboxylic acid exhibiting a first acid dissociation constant of 3 or below at 25°C, colloidal silica, and water and has a pH of 2 to 4; and a method of polishing aluminum films by using the fluid.