| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame which can prevent joining failure of wire-bonding, prevent mis-alignment of die-bonding, prevent peeling of resin from a die pad, prevent occurrence of a bubble of sealing resin or an unfilled sealing resin, and easily perform an appearance inspection of confirming a semiconductor chip mounting position, and also to provide a semiconductor device, and an electronic apparatus. <P>SOLUTION: A channel 18 is formed outside the mounting portion of semiconductor chip 12 in the die pad 22. <P>COPYRIGHT: (C)2007,JPO&INPIT |
