| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode device for enhancing heat radiating property in comparison with the device in the prior art, and for resulting in no breakdown or reduction in operating span of a light emitting diode device due to temperature rise. <P>SOLUTION: The light emitting diode device 1 is provided with a substrate 2. On the front surface of this substrate 2, a plurality of light emitting diodes 3 are mounted, and on the rear surface thereof, a plurality of electronic components 4 forming a lighting circuit are also mounted for lighting control of the light emitting diodes 3. A space provided at least between the light emitting diode 3 and a light guiding portion 5a within a housing 5 is filled with the transparent or semi-transparent first insulating resin 6. In addition, the space is also filled with the second insulating resin 7 having the thermal conductivity higher than that of the first insulating resin 6 in view of further closing the space in the rear surface side of the substrate 2 from the first insulating resin 6. <P>COPYRIGHT: (C)2007,JPO&INPIT |
