发明名称 WIRING CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME AND MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring circuit substrate on which a conductive pattern having high reliability is mounted, and an electronic component is accurately mounted, and also to provide a method for manufacturing the wiring circuit substrate, and for mounting the electronic component. <P>SOLUTION: An insulating layer 3 having a mounting portion 10 is formed on a metal supporting layer 2 whose specular gloss at an incident angle 45&deg; is 150-500%, and a conductive pattern 4 is formed on the insulating layer 3 to inspect a quality of figure of the conductive pattern 4 by a reflective optical sensor 24. Then, a portion layered with a mounting portion 10 on the metal supporting layer 2 is etched to form an opening 16 so that a haze value of the insulating layer 3 of the mounting portion 10 exposed by etching is 20-50%, then a tape carrier 1 for TAB is obtained. Then, the electronic component 21 and the mounting portion 10 are positioned by a reflective type optical sensor 29 to mount the electronic component 21 on the mounting portion 10. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007134658(A) 申请公布日期 2007.05.31
申请号 JP20050329010 申请日期 2005.11.14
申请人 NITTO DENKO CORP 发明人 NAKAMURA KEI;ISHIZAKA HITOSHI
分类号 H05K3/00;H01L21/60;H05K13/04 主分类号 H05K3/00
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