| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent shortcircuiting between leads due to re-adhesion of a solder when an external lead is cut. <P>SOLUTION: The lead cutting device 5 is provided with a punch 12 and a die 10, and they are relatively moved to cross the thickness direction of an external lead 3, and then the tip of the external lead 3 is cut. The side surfaces (cutting blade surface) of the punch 12 and the die 10 are ground nearly parallel to the sliding direction of the cutting surface of the external lead 3, and they are coated with diamond films 11b and 11a. Due to such the structure, when the external lead 3 is cut, a solder can be prevented from being peeled and being readhered. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
