发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To efficiently form an amorphous thin-film containing reduced amounts of impurities on a substrate without requiring a rapid thermal annealing process and frequent cleaning processes. SOLUTION: A method of manufacturing a semiconductor device comprises a film-forming step for forming a thin-film on a substrate by feeding a film-forming gas to the substrate and a film-refining step for refining the thin-film formed in the film-forming step by feeding a reactant in which an oxygen-containing gas has been activated to the substrate, wherein the both steps are conducted in a same reaction chamber and are consecutively repeated a plurality of times. The film-forming gas to be fed to the substrate in the film-forming process and the reactant to be fed to the substrate in the film-refining process are fed from a same feeding port into the reaction chamber. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007134733(A) |
申请公布日期 |
2007.05.31 |
申请号 |
JP20070003174 |
申请日期 |
2007.01.11 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
ASAI MASAYUKI;NOMURA HISASHI;HORII SADAYOSHI |
分类号 |
H01L21/316;C23C16/40;H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
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地址 |
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