发明名称 EPOXY RESIN ADHESIVE COMPOSITION AND ADHESIVE FOR OPTICAL SEMICONDUCTOR USING IT
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin adhesive composition which controls short wavelength-wave absorption, is excellent in ultraviolet resistance, weather resistance, reflexivity and storage stability, has an excellent coatability for use in assemblies of semiconductor devices mounting optical semiconductor chips and bonding various kinds of components and shows excellent light reflexivity and an adhesive for an optical semiconductors using the composition. SOLUTION: The light-reflecting epoxy resin adhesive composition indispensably contains (A) an alicyclic epoxy compound, (B) a silane compound containing a hydrolyzable group directly coupling with a silicon atom, (c1) a divalent organic tin compound, (c2) a quadrivalent organic tin compound and (D) a light-reflecting inorganic filler. The contents of the components are; (A): 1-90 wt.%, (B): 0.1-15 wt.%, (c1): 0.01-5 wt.%, (c2): 0.01-5 wt.% and (D): 3-90 wt.% each based on the total amount of the composition. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007131677(A) 申请公布日期 2007.05.31
申请号 JP20050323719 申请日期 2005.11.08
申请人 SUMITOMO METAL MINING CO LTD 发明人 TANAKA MASAFUMI
分类号 C09J163/00;C08G59/68;C09J11/04;C09J183/00;H01L21/52 主分类号 C09J163/00
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