WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a wafer level package structure wherein a plurality of small sensor devices having less sensor characteristic fluctuation are formed. A method for manufacturing such package structure is also provided. The package structure includes a semiconductor wafer having a plurality of sensor units, and a package wafer bonded on the semiconductor wafer. The semiconductor wafer has a first metal layer formed on each of the sensor units, and the package wafer has a bonding metal layer at a position facing the first metal layer. Since the bonding portion between the semiconductor wafer and the package wafer is formed by directly bonding the activating surface of the first metal layer on the activating surface layer of the bonding metal layer at a room temperature, the sensor characteristics are prevented from being fluctuated by residual stress on the bonding section.