| 摘要 |
<p>A soldering apparatus is provided with a container that receives and encloses hermetically a circuit board, a weight set immediately above a semiconductor element to press the same against the circuit board, and a high frequency heating coil to heat the weight by electromagnetic induction. Further, the high frequency heating coils is disposed separately from the weight. The generation of heat by the weight heats a plurality of junction portions of the circuit board to solder the junction portions and the semiconductor element together. As a result, a structure of the soldering apparatus can be simplified and its efficient heating can be put into practice.</p> |
