| 摘要 |
PROBLEM TO BE SOLVED: To increase the size of each pad which is formed on the undersurface of backing with a built-in lead array. SOLUTION: A lead lower-end array is formed on the undersurface of the backing, and a plurality of lead lower-end sub-arrays 34 are set for the lead lower-end array. The sub-array 34 is composed of at least two lead lower-end rows 26. In each of the sub-arrays 34, a lower end of a lead is positioned in such a manner that only one lower end of the lead exists in each Y-direction section. Thus, the X-direction size of each section can be increased. When a pitch between the lower end of the leads is increased, the Y-direction size of each section can also be increased. COPYRIGHT: (C)2007,JPO&INPIT
|
