发明名称 System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system
摘要 According to one embodiment of the invention, a cooling system for a heat-generating structure that is disposed in an environment having an ambient pressure comprises a fluid coolant and three structures. The first structure allows the heat generating structure to removably couple to the cooling system. The second structure reduces a pressure of the fluid coolant to a subambient pressure at which the fluid coolant has a boiling temperature less than a temperature of the heat-generating structure. The third structure directs a flow of the fluid coolant in the form of a liquid at the subambient pressure in a manner causing the fluid coolant to be brought into thermal communication with the heat-generating structure where heat from the heat-generating structure causes the fluid coolant in the form of the liquid to boil and vaporize so that the fluid coolant absorbs heat from the heat-generating structure as the fluid coolant changes state.
申请公布号 US2007119199(A1) 申请公布日期 2007.05.31
申请号 US20050291041 申请日期 2005.11.30
申请人 RAYTHEON COMPANY 发明人 WEBER RICHARD M.;RUMMEL KERRIN A.;PAYTON ALBERT P.;WYATT WILLIAM G.
分类号 F25D23/12 主分类号 F25D23/12
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