Method and zone for sealing between two microstructure substrates

摘要

The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level ( 20 ), a lower edging ( 22 A) made of an adhesive material capable of causing the first substrate ( 20 ) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level ( 30 ); on said lower edging ( 22 A), a layer of said sealing material; and on said layer of sealing material, a protuberance ( 36 ) formed on said second wafer level ( 30 ) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.