发明名称 Method of determining remaining layer thickness when forming blind holes or cuts in components formed at least partly of plastic
摘要 <p>The method involves forming the holes or cuts using a laser beam from one side of the component. The opposite surface of the component is made of organic material and at this surface the temperature is determined in a contact free manner using electromagnetic radiation emitted from the surface. From this, the remaining thickness in the region of the laser beam can be determined.</p>
申请公布号 DE102005054607(A1) 申请公布日期 2007.05.31
申请号 DE20051054607 申请日期 2005.11.11
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 发明人 KRETZSCHMAR, FRANK;LEMINSKI, MICHAEL;MORGENTHAL, LOTHAR;POLLACK, DIETER;SCHWARZ, THOMAS
分类号 G01B11/06;B23K26/02 主分类号 G01B11/06
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