Method of determining remaining layer thickness when forming blind holes or cuts in components formed at least partly of plastic
摘要
<p>The method involves forming the holes or cuts using a laser beam from one side of the component. The opposite surface of the component is made of organic material and at this surface the temperature is determined in a contact free manner using electromagnetic radiation emitted from the surface. From this, the remaining thickness in the region of the laser beam can be determined.</p>
申请公布号
DE102005054607(A1)
申请公布日期
2007.05.31
申请号
DE20051054607
申请日期
2005.11.11
申请人
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
发明人
KRETZSCHMAR, FRANK;LEMINSKI, MICHAEL;MORGENTHAL, LOTHAR;POLLACK, DIETER;SCHWARZ, THOMAS