PCB ELECTRO COMPONENT EMBEDDED ELECTRO COMPONENT AND METHOD OF THE SAME

摘要

An electronic component embedded PCB and a method of manufacturing the same are provided to reduce the thickness by connecting an electrode and a circuit pattern on a single core substrate and to remove the problems due to defective plating of a via hole by not forming the via hole connecting the electrode and the circuit pattern. An electronic component embedded PCB(40) includes a core substrate(41), a filling unit(46), an electronic component(45), and a circuit pattern(48). The core substrate(41) has a through hole(47). The filling unit is filled in the through hole(47). The electronic component(45) is embedded in the filling unit(46), and a surface of an electrode(451) is exposed to a surface of the filling unit(46). The circuit pattern(48) is formed on the core substrate(41) to be electrically connected to the electrode(451).