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发明名称
MANUFACTURING METHOD OF MEMORY DEVICE USING PARTIAL FAILED MULTI CHIP PACKAGE
摘要
申请公布号
KR20070054795(A)
申请公布日期
2007.05.30
申请号
KR20050112747
申请日期
2005.11.24
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
YUN, JONG PIL
分类号
H01L23/28;H01L23/04
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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