| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a molded item with an excellent added value by recycling a cured phenol resin such as a printed circuit board and the like effectively and to provide a high-performance heat insulator using this molded item. <P>SOLUTION: This molded item is obtained by (a) heat-treating a cured phenol resin to obtain a thermally decomposed material-containing residue, (b) separating the thermally decomposed material from the residue, (c) adding at least a condensation agent, a condensation catalyst and a solvent to obtain a wet gel and drying the wet gel to remove the solvent. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
