micro system component and method for bonding micro components to a substrate

摘要

Granular adhesive (5) is applied to the surface of the substrate (1) or to the microcomponent and fused in a precise pattern by the application of a focussed heat source, e.g. a laser. Excess adhesive is then removed and the component is placed in position and glued by further heating. Various methods of applying the adhesive are given, e.g. a heated pneumatic gripper (6) or needle, or partial dipping with a raised surface structure (3, 4). Further application methods include electrostatic charging, a contoured sieve or mask, the use of a shaped transfer film, an electrostatic transfer roller, and mechanical punching of a transfer film on to the surface. The gripper (6) can also be used to dip the pre-heated component in powdered adhesive and place it in position. The adhesive is in the form of granules in the size range of 0.5 to 150 mu m.