| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and method for fixing substrate by which various kinds of substrates are fixed certainly by means of a simple mechanism. <P>SOLUTION: In the substrate fixing device which is positioned to the mounting position 13a of an electronic component mounting device and fixes a substrate 13 by receiving the substrate 13 from the downside, a carrier 11 having an opening 11a is caused to hold the substrate 13 and a substrate contacting member 15 having an opening 15a formed correspondingly to a component mounting position 13a is positioned above a receiving member 5 in a state where the member 15 is placed on the top surface of the substrate 13. When the substrate 13 is received by means of the receiving member 5, the substrate 13 is held by suction by bringing a receiving surface 7a into contact with the bottom surface of the substrate 13 by lowering transport rails 10 and, at the same time, the substrate 13 is fixed by pressing the substrate 13 against the receiving surface 7a by exerting draw-in forces on the substrate contacting member 15 from suction pads 8. Consequently, various kinds of substrates are fixed certainly by means of the simple mechanism. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
