| 摘要 |
A memory module includes a body with a plurality of memory chips mounted thereon and an elongated connector protruding from the body. The elongated connector includes a plurality of single in-line memory module (SIMM)-type contacts at first portions along an edge thereof and a plurality of dual in-line memory module (DIMM)-type contacts at second portions along the edge thereof. The plurality of SIMM-type contacts may be positioned at opposing end portions of the elongated connector, and the plurality of DIMM-type contacts may be positioned between the opposing end portions. Related memory systems including a system board having a socket therein configured to receive the memory module are also discussed. |
