| 摘要 |
A multi-layer integrated circuit device comprises a plurality of superimposed insulating layers (1, 2, 3, 4) which carry signal tracks (S, SS) and power supply tracks (P, G) and a substrate (e.g. silicon) (5) which carries the superimposed insulating layers and the various circuit components of the device. Each layer of an adjacent pair of insulating layers (3, 4) carries relatively long signal tracks (S) interspersed in parallel relationship with power and ground tracks (P and G) with the tracks in the respective layers (3, 4) are disposed orthogonally relative to one another. The intersection points (7) of the effective power supply grid defined by the power and ground tracks (P, G) in the two layers (3, 4) are appropriately connected to the circuit components carried by the substrate (5) of the device. <IMAGE> |
