| 发明名称 |
Semiconductor chip mounting substrate and flat display |
| 摘要 |
A semiconductor chip mounting substrate having a semiconductor bare chip and a substrate electrically connected to the semiconductor bare chip by wire bonding is provided. Here, a protective film is provided on the surface of the semiconductor bare chip and is disposed so as to expose all or a part of a bonding wire.
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| 申请公布号 |
US7224044(B2) |
申请公布日期 |
2007.05.29 |
| 申请号 |
US20020331918 |
申请日期 |
2002.12.31 |
| 申请人 |
FUJITSU HITACHI PLASMA DISPLAY LIMITED |
发明人 |
KAWADA TOYOSHI;SANO YUJI |
| 分类号 |
G02F1/1345;H01L23/495;G06F1/16;G09G3/28;H01L23/02;H01L23/057;H01L23/29;H01L23/31;H01L23/488;H01L23/538;H05K7/20 |
主分类号 |
G02F1/1345 |
| 代理机构 |
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代理人 |
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| 主权项 |
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