发明名称 Stripline structure with multiple ground vias separated by no more than 100 mil
摘要 A stripline structure. The stripline structure includes a stripline transmission line, a first ground plane, a first dielectric layer overlaying the first ground plane, a conductive trace overlaying the first dielectric layer, a second dielectric layer overlaying the conductive trace, a second ground plane overlaying the second dielectric layer, multiple first conductive vias, and multiple second conductive vias. Each first conductive via and each second conductive via electrically connects the first ground plane to the second ground plane. The multiple first conductive vias are located along a first line parallel to the conductive trace, and the multiple second conductive vias are located along a second line parallel to the conductive trace. The first line and the second line are located on opposite sides of the conductive trace.
申请公布号 US7224249(B2) 申请公布日期 2007.05.29
申请号 US20050222268 申请日期 2005.09.08
申请人 AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. 发明人 VAN QUACH MINH;SAWYER T. SHANNON;BURTON WILLIAM SCOTT
分类号 H01P3/08 主分类号 H01P3/08
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