发明名称 SUBSTRATE ASSEMBLY DEVICE FOR HIGH DENSITY TERMINAL CONNECTOR
摘要 PURPOSE:To enable the insertion of all terminals in through-holes without any damage by using a guide member for so correcting the forward end position of the terminals as to correspond to the through-holes. CONSTITUTION:The widthwise comb part 13 of a widthwise guide member 11 and the lengthwise comb part of a lengthwise guide member 10 are geared with each other in a substrate assembly device 7 for giving a maximum pitch between each terminal of a high density terminal connector 1, thereby forming a terminal insertion correction guide part 15 having recessed divisions. Then, when a substrate 3 is set at the prescribed position and the terminals of a connector 1 are inserted in the guide part 15, each terminal enters the corresponding position thereof because of the large pitch of the guide part 15. The bend and curvature of the terminals are thereby corrected. If projected to the lower side of the guide part 15, the terminals are so corrected as to correspond to the pitch of through-holes 4. Thus, when inserted as corrected, the terminals enters the through holes 4 of the substrate 3 just under the guide part 15. According to the aforesaid construction, many terminals can be inserted in the through- holes 4 without any damage and with ease.
申请公布号 JPH03238775(A) 申请公布日期 1991.10.24
申请号 JP19900033637 申请日期 1990.02.16
申请人 OKI ELECTRIC IND CO LTD 发明人 MIZOGUCHI SHIGEMASA;IDA TAKASHI
分类号 H01R43/20 主分类号 H01R43/20
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