| 发明名称 |
Method for improving selectivity of electroless metal deposition |
| 摘要 |
A method of depositing a metal cladding on conductors in a damascene process is described. The potential between, for instance, cobalt ions in electroless solution and the surface of an ILD between the conductors is adjusted so as to repel the metal from the ILD.
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| 申请公布号 |
US7223694(B2) |
申请公布日期 |
2007.05.29 |
| 申请号 |
US20030459131 |
申请日期 |
2003.06.10 |
| 申请人 |
INTEL CORPORATION |
发明人 |
CHENG CHIN-CHANG;DUBIN VALERY M.;MOON PETER K. |
| 分类号 |
H01L21/44;H01L21/288;H01L21/768 |
主分类号 |
H01L21/44 |
| 代理机构 |
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