发明名称 |
Die sorter with reduced mean time to convert |
摘要 |
An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2''x2'' or 4''x4'' waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments, the adapter frame has molded individual cavities to hold single die carriers. The adapter frame has the same exterior dimensions as a conventional wafer frame. This allows the adapter frame to be handled at the die sorter output in the same or similar manner as output wafer frames, thereby eliminating the need to change handlers when switching the output from a wafer frame to a specific die carrier.
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申请公布号 |
US7222737(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20030614573 |
申请日期 |
2003.07.03 |
申请人 |
ORTHODYNE ELECTRONICS CORPORATION |
发明人 |
CAPARRO DONALD T.;GORDON LUIS ALFONSO |
分类号 |
B65D85/00;B07C5/36;H01L21/00;H01L21/673 |
主分类号 |
B65D85/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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