发明名称 |
Electronic component package |
摘要 |
An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
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申请公布号 |
US7224076(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20050080859 |
申请日期 |
2005.03.15 |
申请人 |
AGERE SYSTEMS INC |
发明人 |
AGRAWAL GAURAV;BOOKER JESSE W.;SOSH CHRISTOPHER E. |
分类号 |
H01L23/48;G02B6/42;H01L23/498;H01L23/52;H01L23/66;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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