发明名称 |
Method of producing an electronic component and a panel with a plurality of electronic components |
摘要 |
The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.
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申请公布号 |
US7223639(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20040989650 |
申请日期 |
2004.11.16 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BLASZCZAK STEPHAN;REISS MARTIN |
分类号 |
H01L23/28;H01L21/56;H01L23/31;H01L23/498 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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