发明名称 |
Thermal enhance package with universal heat spreader |
摘要 |
A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat spreader is mounted on the back surface of the semiconductor chip. Therein the universal heat spreader has a plurality of through holes for upgrading the efficiency of heat transmission. Moreover, a heat transmission pin is provided in one of the through holes to increase the areas for heat dissipation so as to enhance the thermal performance of the package.
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申请公布号 |
US7224057(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20030657132 |
申请日期 |
2003.09.09 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
YANG CHING-HSU |
分类号 |
H01L23/495;H01L21/00;H01L23/10;H01L23/12;H01L23/15;H01L23/28;H01L23/34;H01L23/36;H01L23/367 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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