| 摘要 |
A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body ( 20 ) defining a central chamber ( 21 ) therein and having a number of fins ( 22 ) on an outside thereof, liquid coolant received in the central chamber, a first fan ( 40 ) received in the central chamber, and a second fan ( 60 ) positioned over the main body and engaged with the first fan. The heat sink assembly couples forced liquid cooling and forced airflow cooling, and need not extra pipes to form a circuit for the liquid coolant. Thus, not only the volume of the heat sink assembly is lessened, but also facilitates matching with electronic components.
|
