发明名称 |
METHOD FOR FORMING MULTI-LAYER BUMPS ON A SUBSTRATE |
摘要 |
A method for forming multi-layer bumps on a substrate includes depositing a first metal powder on the substrate, and selectively melting or reflowing a portion of the first metal powder to form first bumps. A second metal powder is then deposited on the first bumps, and melted to form second bumps on the first bumps. A masking plate is disposed over the substrate to select the portions of the metal powders that are melted and the metal powders are melted via an irradiation beam. The multi-layer bump is formed without the need for any wet chemicals. |
申请公布号 |
SG131913(A1) |
申请公布日期 |
2007.05.28 |
申请号 |
SG20060074819 |
申请日期 |
2006.10.27 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
SHIU, HEI MING;CHAU, ON LOK;LAI, GOR AMIE |
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