发明名称 SELF-PATTERING OF PHOTO-ACTIVE DIELECTRIC MATERIALS FOR INTERCONNECT ISOLATION
摘要 <p>In accordance with the objectives of the invention a new method is provided for the creation of an interconnect pattern. The invention provides for a layer of Photo-Active Dielectric (PAD) to be used for the insulation material in which the interconnect pattern is created, this without the use of an overlying exposure mask of photoresist.</p>
申请公布号 SG131948(A1) 申请公布日期 2007.05.28
申请号 SG20070030521 申请日期 2004.10.14
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 PING LU WU;CHAO ZHANG BEI;CHOO HSIA LIANG
分类号 H01L21/4763;H01L21/48;H01L21/768;H01L23/48;H01L23/532;H01L29/40 主分类号 H01L21/4763
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