发明名称 Laminate for printed circuit board and preparing method thereof
摘要 The present invention relates to a laminate for a printed circuit board, which is manufactured by incorporating woven fabric or nonwoven fabric formed of liquid crystal polyester fibers into a liquid crystal polyester resin, thus having a low dielectric constant and a low dissipation factor, suitable for use in the high frequency range (GHz or more), and exhibiting excellent thermal properties and high reliability, resulting in high processability.
申请公布号 KR100722626(B1) 申请公布日期 2007.05.28
申请号 KR20050049862 申请日期 2005.06.10
申请人 发明人
分类号 H05K1/03 主分类号 H05K1/03
代理机构 代理人
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