ALL LAYER INNER VIA HALL PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THAT UTILIZE THE FILL PLATING,申请号KR20050089291-传众专利搜索

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发明名称	ALL LAYER INNER VIA HALL PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THAT UTILIZE THE FILL PLATING
摘要
申请公布号	KR100722599(B1)	申请公布日期	2007.05.28
申请号	KR20050089291	申请日期	2005.09.26
申请人		发明人
分类号	H05K3/40;H05K3/46	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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