发明名称 METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BURIED GATE
摘要 <p>A method for fabricating a semiconductor device having a buried gate is provided to preserve a liner formed on both sidewalls of an active region overlapped over the gate by extending the gate onto an isolation layer. An isolation trench is formed on a semiconductor substrate to define an active region(S20). A liner is formed on a sidewall of the active region(S30). An isolation layer is formed to fill the isolation trench(S40), and a hard mask pattern is formed on the substrate(S50). The substrate is etched by using the hard mask pattern as an etching mask to form a gate trench(S60). A gate is formed on the gate trench(S70), and then the hard mask pattern is removed(S80). A gate capping pattern is formed on the gate(S90).</p>
申请公布号 KR100724578(B1) 申请公布日期 2007.05.28
申请号 KR20060073666 申请日期 2006.08.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, BONG SOO;KIM, YUN GI;SEO, HYEOUNG WON
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
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