METHOD OF EXPOSING A A SEMICONDUCTOR WAFER

摘要

A method for exposing a semiconductor wafer is provided to restrain the performance of a resetting process of coordinates for an alignment mark in spite of the change of a die shape of a reticle by setting the coordinates of the alignment mark using a semiconductor wafer as a reference. Coordinates of an alignment mark are set by using the center of a semiconductor wafer as a reference(S30). The semiconductor wafer and a reticle are loaded into exposure equipment(S40). The semiconductor wafer and the reticle are aligned with each other. An exposure process is then performed on the semiconductor wafer(S50).