MANUFACTURING METHOD OF ALL LAYER INNER VIA HALL PRINTED CIRCUIT BOARD THAT UTILIZES THE FILL PLATING,申请号KR20050081731-传众专利搜索

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发明名称	MANUFACTURING METHOD OF ALL LAYER INNER VIA HALL PRINTED CIRCUIT BOARD THAT UTILIZES THE FILL PLATING
摘要
申请公布号	KR100722605(B1)	申请公布日期	2007.05.28
申请号	KR20050081731	申请日期	2005.09.02
申请人		发明人
分类号	H05K3/40;H05K3/46	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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